Mini Heatbed MOS High Power MOSFET Expansion Module for 3D Printer

Mini Heatbed MOS High Power MOSFET Expansion Module has a mini appearance, compact design, with more powerful heating, to solve the problem of current load due to excessive hot bed power, under normal heat dissipation, the module measured I (Max) = 30A can stand long-term work, please note that the current does not exceed 30A when using.

Features:

• Model: Mini MOS Module
• It can directly use the Ramp1.4 and MKS series motherboard hot bed output signal control.
• Extra-large heat sink, the maximum current can be up to 30A or more.

Package Includes:

1 x Mini Heatbed MOS High Power MOSFET Expansion Module.

1 x 2pin Signal Cable.